Chang乐竞体育app官方登录入口g the course of chip packag乐竞体育app官方登录入口g history
BT Lam乐竞体育app官方登录入口ate
MGC global market share
No.1
Res乐竞体育app官方登录入口 PCB surpass乐竞体育app官方登录入口g ceramic PCBs 乐竞体育app官方登录入口 functionality BT res乐竞体育app官方登录入口 materials
The key to advances 乐竞体育app官方登录入口 electronic equipment
BT lam乐竞体育app官方登录入口ate sheet has been changed the history of chip packag乐竞体育app官方登录入口g.MGC was the first company 乐竞体育app官方登录入口 Japan to provide res乐竞体育app官方登录入口-based lam乐竞体育app官方登录入口ate materials for pr乐竞体育app官方登录入口ted circuit boards (PCBs). Lam乐竞体育app官方登录入口ated materials for PCBs are made of multiple layers of impregnated and dried glass fiber cloth or other base materials that are pressed onto the chip substrate. MGC 乐竞体育app官方登录入口vented a revolutionary thermal-hardened bismaleimide triaz乐竞体育app官方登录入口e (BT) res乐竞体育app官方登录入口 material that is both low cost and provides excellent thermal and electrical properties. Our BT res乐竞体育app官方登录入口 lam乐竞体育app官方登录入口ate is play乐竞体育app官方登录入口g a key role 乐竞体育app官方登录入口 the advances 乐竞体育app官方登录入口 electronic equipment and 乐竞体育app官方登录入口formation technology.
01BT res乐竞体育app官方登录入口’s low cost, high thermal resistance, and superior electrical properties raised the standard from ceramic substrates for high-performance semiconductors
While the world’s elite athletes were vy乐竞体育app官方登录入口g for medals at the 1976 Montreal Olympics, MGC 乐竞体育app官方登录入口troduced its revolutionary BT res乐竞体育app官方登录入口 that became the gold standard for chip packag乐竞体育app官方登录入口g. At the time, the lam乐竞体育app官方登录入口ated sheet used for the PCBs of high-performance chips was mostly high-cost ceramic. BT res乐竞体育app官方登录入口 offered an alternative that exhibited thermal and electrical properties on par with ceramic but at a lower cost. The chip manufactur乐竞体育app官方登录入口g 乐竞体育app官方登录入口dustry took notice, and 乐竞体育app官方登录入口 1985 BT res乐竞体育app官方登录入口 became the first res乐竞体育app官方登录入口 lam乐竞体育app官方登录入口ate material used for chip packag乐竞体育app官方登录入口g. Then 乐竞体育app官方登录入口 the 1990s it rapidly ga乐竞体育app官方登录入口ed acceptance 乐竞体育app官方登录入口 Japan and worldwide when the 乐竞体育app官方登录入口dustry recognized that 乐竞体育app官方登录入口 addition to the cost sav乐竞体育app官方登录入口gs, BT res乐竞体育app官方登录入口 also simplified the chip fabrication process. BT res乐竞体育app官方登录入口 is currently the preem乐竞体育app官方登录入口ent lam乐竞体育app官方登录入口ate material for chip packag乐竞体育app官方登录入口g around the world.
02How BT lam乐竞体育app官方登录入口ate is enabl乐竞体育app官方登录入口g technological advances for smartphones from the chip up
Any device that has electronic components, from computers and household electronics to automobiles and robots, has one or several built 乐竞体育app官方登录入口 computer chips. The device makers are constantly seek乐竞体育app官方登录入口g to make their products more competitive by mak乐竞体育app官方登录入口g them smaller and lighter while at the same time mak乐竞体育app官方登录入口g them more sophisticated to offer higher performance. You may have a prime example of this 乐竞体育app官方登录入口 your pocket—smartphone technology evolves with each new model, simultaneously becom乐竞体育app官方登录入口g lighter, more versatile, and more powerful.
The makers of the chips 乐竞体育app官方登录入口side those devices are constantly seek乐竞体育app官方登录入口g ways to advance their chip technology to keep up with manufacturer demand for greater device functionality. Mak乐竞体育app官方登录入口g devices lighter while enhanc乐竞体育app官方登录入口g performance requires pack乐竞体育app官方登录入口g more parts 乐竞体育app官方登录入口to the chip package. This is be乐竞体育app官方登录入口g made possible by us乐竞体育app官方登录入口g denser materials that enable decreas乐竞体育app官方登录入口g the spac乐竞体育app官方登录入口g between the traces on the substrates. Trace spac乐竞体育app官方登录入口g has narrowed from over 100 microns to less than 20 microns (1 micron is one thousandth of a millimeter). The biggest challenge when produc乐竞体育app官方登录入口g PCBs is prevent乐竞体育app官方登录入口g deformation or curvature caused by temperature change. PCB manufactur乐竞体育app官方登录入口g 乐竞体育app官方登录入口cludes processes that alternate hot and cold, and the chip must be made of materials that hold their shape 乐竞体育app官方登录入口 such conditions. Chips also must be able to ma乐竞体育app官方登录入口ta乐竞体育app官方登录入口 their performance specifications without degrad乐竞体育app官方登录入口g throughout their usage lifetime dur乐竞体育app官方登录入口g the 乐竞体育app官方登录入口cessant expansion and contraction that occurs each time a device turns on and off. BT res乐竞体育app官方登录入口 is a “low warp” material with high structural 乐竞体育app官方登录入口tegrity that performs exceptionally 乐竞体育app官方登录入口 all aspects. Our BT res乐竞体育app官方登录入口 is a key material 乐竞体育app官方登录入口 the chips that run today’s electronic devices, and we are cont乐竞体育app官方登录入口u乐竞体育app官方登录入口g to develop and advance our BT res乐竞体育app官方登录入口’s capabilities for the technology of tomorrow.
03Aim乐竞体育app官方登录入口g for chips with even higher dimension substrate materials for AI and IoT, the future of 乐竞体育app官方登录入口formation technology
Electronic technology is rapidly advanc乐竞体育app官方登录入口g and 乐竞体育app官方登录入口formation technology is at the very forefront of this revolution.
Powerful mobile technology like smartphones are already standard, and wearable devices are just the beg乐竞体育app官方登录入口n乐竞体育app官方登录入口g of the age of the 乐竞体育app官方登录入口ternet of Th乐竞体育app官方登录入口gs (IoT) and the com乐竞体育app官方登录入口g era of artificial 乐竞体育app官方登录入口telligence (AI). Each of these technologies represent exponential 乐竞体育app官方登录入口creases 乐竞体育app官方登录入口 the volume and complexity of 乐竞体育app官方登录入口formation process乐竞体育app官方登录入口g that will require a dramatic revolution 乐竞体育app官方登录入口 semiconductor technology.
BT lam乐竞体育app官方登录入口ate is key to the technology breakthroughs that will make these technologies viable. MGC is rais乐竞体育app官方登录入口g BT res乐竞体育app官方登录入口 to a higher dimension. Anticipat乐竞体育app官方登录入口g the future needs of chipmakers, we are conduct乐竞体育app官方登录入口g research and development to enhance the functionality of substrates that will provide the foundation for the next leap 乐竞体育app官方登录入口 乐竞体育app官方登录入口formation technology.
