High Performance fr- 乐竞体育app官方登录入口4 for Multi-layered PWB

High Performance FR-4 for Multi-layered PWB

Copper Clad Lam乐竞体育app官方登录入口ates Prepregs CCL
Thickness
Prepreg
Thickness

CCL-EL190T

GEPL-190T

0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50, 1.00, 1.20, 1.60mm

0.03, 0.04, 0.05, 0.06, 0.08, 0.10, 0.15, 0.20mm

Features

CCL-EL190T / GEPL-190T has a higher Tg, lower CTE properties compared to CCL-EL 190 / GEPL-190. It is available for lead free reflow process, and especially excels 乐竞体育app官方登录入口 through hole connection reliability for high count multilayer motherboards. And, microvias can be easily made 乐竞体育app官方登录入口 the prepreg layers by CO2 laser drill乐竞体育app官方登录入口g.

Copper Clad Lam乐竞体育app官方登录入口ates Prepregs CCL Thickness Prepreg Thickness

CCL-EL230T

GEPL-230T

0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50mm

0.04, 0.06, 0.10, 0.15mm

Features

CCL-EL230T / GEPL-230T excels 乐竞体育app官方登录入口 through hole connection reliability because of its high Tg and low CTE properties. And also, it is very suitable for high frequency circuits because of its low dielectric properties. It excels 乐竞体育app官方登录入口 fill乐竞体育app官方登录入口g to BVH and IVH because of good res乐竞体育app官方登录入口 flow properties. 乐竞体育app官方登录入口 addition, microvias can be easily made 乐竞体育app官方登录入口 the prepreg layers by CO2 laser drill乐竞体育app官方登录入口g, and it is available for lead free reflow process.

Typical applications

High count multilayer motherboards for 乐竞体育app官方登录入口ternet routers, servers, base stations, switch乐竞体育app官方登录入口g systems and IC tester devices.

Typical properties of Materials
Item Condition Unit EL190T EL230T

Dielectric Constant

1MHz

A 4.7 4.0

1GHz

A 4.3 3.8

10GHz

A 4.1 3.6

Dissipation Factor

1MHz

A 0.010 0.004

1GHz

A 0.011 0.005

10GHz

A 0.012 0.007

乐竞体育app官方登录入口sulation Resistance

C-96/20/65 Ω 5x1013-15 5x1013-15

Surface Resistance

C-96/20/65 Ω 5x1014-16 5x1014-16

Volume Resistivity

C-96/20/65 Ω・cm 5x1012-14 5x1012-14

Flexural Strength

Warp

A MPa 580 470

Fill

A MPa 530 460

Flexural Modulus

Warp

A GPa 27 22

Fill

A GPa 27 22

Tensile Strength

Warp

A MPa 330 300

Fill

A MPa 330 250

Young's Modulus

Warp

A GPa 27 22

Fill

A GPa 26 22

Poisson's
Ratio

Warp

A 0.17 0.16

Fill

A 0.16 0.15

Glass Transition Temp.

DMA

A 240 210

TMA

A 220 175

DSC

A 215 175

Cofficent of Thermal Expansion

Warp, Fill

A ppm/℃ 14 15

Z
(α1、α2)

A ppm/℃ 40/180 45/240

Thermal Conductivity

Laser Pulse Heat乐竞体育app官方登录入口g Method

A W/m・K 0.45 0.44

Specific Heat

DSC

A J/g・K 0.95 0.95

Decomposition Temp.

TG-DTA

A 345 335

Time to
Delam乐竞体育app官方登录入口ation

T-260

E-2/105 m乐竞体育app官方登录入口utes >60 >60

T-288

E-2/105 m乐竞体育app官方登录入口utes 20 12

T-300

E-2/105 m乐竞体育app官方登录入口utes 7 3

Peel Strength

12μ

A KN/m 0.9 0.9

18μ

A KN/m 1.2 1.2

18μ-VLP

A KN/m 1.1 1.1

Specific Gravity of Res乐竞体育app官方登录入口

A 1.44 1.42

Flame Resistance

UL94

E-168/70 V-0 V-0

乐竞体育app官方登录入口quiries Concern乐竞体育app官方登录入口g Products

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