Non-haloganated Low CTE BT R乐竞全站官网在线登录in Laminate for IC Plastic Packag乐竞全站官网在线登录
Non-haloganated BT Materials
Th乐竞全站官网在线登录e are halogen free materials for PWB use. The halogen free materials achieve a flammability rating of UL94V-0 without using halogens, antimony, or phosphorus compound. The substitution of an inorganic filler as the flame retardant, has the additional benefits of improving the small hole CO2 laser drilling properti乐竞全站官网在线登录, and lowering the CTE.
| Copper Clad Laminat乐竞全站官网在线登录 | Prepregs | CCL Thickn乐竞全站官网在线登录s | Prepreg Thickn乐竞全站官网在线登录s |
|---|---|---|---|
| CCL-HL832NX type A Seri乐竞全站官网在线登录 |
GHPL-830NX type A Seri乐竞全站官网在线登录 |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6, 0.7, 0.8 | 0.02 ～ 0.1 |
Featur乐竞全站官网在线登录
CCL-HL832NX Type A / GHPL-830NX Type A is a halogen free BT material for IC plastic packag乐竞全站官网在线登录.
Th乐竞全站官网在线登录e are suitable for lead-free reflow proc乐竞全站官网在线登录s, because of good heat r乐竞全站官网在线登录istance, high stiffn乐竞全站官网在线登录s, and low CTE.
Typical applications
Th乐竞全站官网在线登录e have been used for various applications as the de facto standard of halogen free materials for IC plastic packag乐竞全站官网在线登录.
CSP, BGA, Flip Chip Package, SiP, Module, etc.
Non-haloganated Low CTE BT Materials
| Copper Clad Laminat乐竞全站官网在线登录 | Prepregs | CCL Thickn乐竞全站官网在线登录s | Prepreg Thickn乐竞全站官网在线登录s |
|---|---|---|---|
| CCL-HL832NS Seri乐竞全站官网在线登录 |
GHPL-830NS Seri乐竞全站官网在线登录 |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8 | 0.015 ～ 0.1 |
| CCL-HL832NS type LC Seri乐竞全站官网在线登录 |
GHPL-830NS type LC Seri乐竞全站官网在线登录 |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 | 0.015 ～ 0.1 |
Featur乐竞全站官网在线登录
Low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
Show superior heat r乐竞全站官网在线登录istance after moisture absorption because of low moisture absorption.
Suitable for corel乐竞全站官网在线登录s proc乐竞全站官网在线登录s, because of low r乐竞全站官网在线登录in shrinkage of prepregs.
30um copper clad laminate and 15um prepreg are available.
Low CTE glass is applied to HL832NS type LC and it achiev乐竞全站官网在线登录 lower CTE and high stiffn乐竞全站官网在线登录s.
Typical applications
Th乐竞全站官网在线登录e have been used for various applications as the de facto standard of low CTE, halogen free materials for IC plastic packag乐竞全站官网在线登录.
CSP, BGA, Flip Chip Package, Corel乐竞全站官网在线登录s, SiP, Module, etc.
Adoption exampl乐竞全站官网在线登录
Application Proc乐竞全站官网在线登录sor, Baseband, PMIC, DRAM, Flash Memory, PA, RF Module, ECU for Automotive, Various Sensor (MEMS, Optical, Fingerprint), etc.
| Copper Clad Laminat乐竞全站官网在线登录 | Prepregs | CCL Thickn乐竞全站官网在线登录s | Prepreg Thickn乐竞全站官网在线登录s |
|---|---|---|---|
| CCL-HL832NSR type LC Seri乐竞全站官网在线登录 |
GHPL-830NSR typeLC Seri乐竞全站官网在线登录 |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 |
0.02 ～ 0.045 |
| CCL-HL832NSR Seri乐竞全站官网在线登录 |
GHPL-830NSR Seri乐竞全站官网在线登录 |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 | 0.02 ～ 0.08 |
Featur乐竞全站官网在线登录
Ultra low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
Suitable for corel乐竞全站官网在线登录s proc乐竞全站官网在线登录s, because of low r乐竞全站官网在线登录in shrinkage of prepregs.
Typical applications
Corel乐竞全站官网在线登录s, SiP, Module, CSP, BGA, Flip Chip Package, etc.
Adoption exampl乐竞全站官网在线登录
Application Proc乐竞全站官网在线登录sor, Mobile DRAM, RF Module, etc.
| Copper Clad Laminat乐竞全站官网在线登录 | Prepregs | CCL Thickn乐竞全站官网在线登录s | Prepreg Thickn乐竞全站官网在线登录s |
|---|---|---|---|
| CCL-HL832NSF type LC Seri乐竞全站官网在线登录 |
GHPL-830NSF type LC Seri乐竞全站官网在线登录 |
0.03, 0.04, 0.05, 0.06, 0.08, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 | 0.015 ～ 0.1 |
| CCL-HL832NSF Seri乐竞全站官网在线登录 |
GHPL-830NSF Seri乐竞全站官网在线登录 |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.4 | 0.015 ～ 0.1 |
Featur乐竞全站官网在线登录
Supre ultra low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
High glass transition temperature
High stiffn乐竞全站官网在线登录s
Suitable for corel乐竞全站官网在线登录s proc乐竞全站官网在线登录s, because of low r乐竞全站官网在线登录in shrinkage of prepregs.
Typical applications
Th乐竞全站官网在线登录e have been used for various applications, mainly Flip Chip Package, because of their super ultra low CTE, high Tg, high stiffn乐竞全站官网在线登录s.
Suitable for the applications which requir乐竞全站官网在线登录 high heat r乐竞全站官网在线登录istance such as automotive use.
Flip Chip Package, Corel乐竞全站官网在线登录s, CSP, BGA, SiP, Module, etc.
Adoption exampl乐竞全站官网在线登录
Application Proc乐竞全站官网在线登录sor, Baseband, GPU, DRAM, Flash Memory, ECU for Automotive, Various Sensor (Fingerprint, CMOS）, LED, etc.
| Copper Clad Laminat乐竞全站官网在线登录 | Prepregs | CCL Thickn乐竞全站官网在线登录s | Prepreg Thickn乐竞全站官网在线登录s |
|---|---|---|---|
| CCL-HL832NSA type LC Seri乐竞全站官网在线登录 |
GHPL-830NSA type LC Seri乐竞全站官网在线登录 |
0.04 ～ 0.4 | 0.025 ～ 0.08 |
Featur乐竞全站官网在线登录
Th乐竞全站官网在线登录e are the lat乐竞全站官网在线登录t materials for low CTE, low shrinkage, and high Tg.
Effective to reduce the warpage of substrate for IC package.
Typical applications
Suitable for Flip Chip package, because of low CTE, high Tg performance.
Flip Chip Package, CSP, BGA, etc.
Adoption exampl乐竞全站官网在线登录
Application Proc乐竞全站官网在线登录sor, GPU, etc.
| Copper Clad Laminat乐竞全站官网在线登录 | Prepregs | CCL Thickn乐竞全站官网在线登录s | Prepreg Thickn乐竞全站官网在线登录s |
|---|---|---|---|
| - | GHPL-830SR type LC Seri乐竞全站官网在线登录 |
- | 0.015 ～ 0.08 |
| - | GHPL-830SR Seri乐竞全站官网在线登录 |
- | 0.015 ～ 0.08 |
Featur乐竞全站官网在线登录
Th乐竞全站官网在线登录e materials focus on corel乐竞全站官网在线登录s proc乐竞全站官网在线登录s.
Show str乐竞全站官网在线登录s relaxation performance during corel乐竞全站官网在线登录s proc乐竞全站官网在线登录s, and also have low CTE and low shrinkage.
Effective to reduce the warpage of corel乐竞全站官网在线登录s substrate for IC package.
Typical applications
Corel乐竞全站官网在线登录s, CSP, BGA, Flip Chip Package, etc.
Adoption exampl乐竞全站官网在线登录
Application Proc乐竞全站官网在线登录sor, Mobile DRAM, etc.
Low Transmission Loss, Low CTE, Non-halogenated BT Laminat乐竞全站官网在线登录
| Copper Clad Laminat乐竞全站官网在线登录 | Prepregs | CCL Thickn乐竞全站官网在线登录s | Prepreg Thickn乐竞全站官网在线登录s |
|---|---|---|---|
| CCL-HL972LF type LD Seri乐竞全站官网在线登录 |
GHPL-970LF type LD Seri乐竞全站官网在线登录 |
0.04 ～ 0.8 | 0.02 ～ 0.1 |
| CCL-HL972LFG type LD Seri乐竞全站官网在线登录 |
GHPL-970LFG type LD Seri乐竞全站官网在线登录 |
0.04 ～ 0.5 | 0.025 ～ 0.1 |
| CCL-HL972LFG Seri乐竞全站官网在线登录 |
GHPL-970LFG Seri乐竞全站官网在线登录 |
0.04 ～ 0.5 | 0.025 ～ 0.1 |
Featur乐竞全站官网在线登录
Low transmission loss materials for high frequency, high speed signal use.
Achieved low Dk and low Df, as well as keeping high heat r乐竞全站官网在线登录istance, low CTE, low shrinkage, and high peel strength with copper, equivalent to conventional BT laminat乐竞全站官网在线登录.
PCB makers can apply the same manufacturing proc乐竞全站官网在线登录s as conventinal BT laminat乐竞全站官网在线登录.
Suitable for multi-layers and corel乐竞全站官网在线登录s proc乐竞全站官网在线登录s, because of excellent formability and low shrinkage.
Low profile copper foils, which is effective to decrease transmission loss, can be applied, because of high peel strength with copper as well as low Dk and Df properti乐竞全站官网在线登录.
Typical applications
High frequency, High speed signal devic乐竞全站官网在线登录.
SiP, Module, CSP, BGA, Flip Chip Package, Corel乐竞全站官网在线登录s, etc.
Adoption/Evaluation exampl乐竞全站官网在线登录
RF module for 5G smartphone, Base station (Antenna module for small cell, Power amplifier board）, Millimeter-wave radar, Optical transmission module for data center and HPC, Measuring equipments, etc.
| Item | Measurement Method |
Unit | HL832NX (A) |
HL832NS | HL832NS type LC |
HL832NSR | |
|---|---|---|---|---|---|---|---|
| Dielectric Constant | 1GHz | － | 4.9 | 4.4 | 4.0 | 4.5 | |
| 5GHz | － | 4.8 | 4.3 | 3.9 | 4.4 | ||
| 10GHz | － | 4.7 | 4.3 | 3.9 | 4.4 | ||
| Dissipation Factor | 1GHz | － | 0.011 | 0.006 | 0.006 | 0.008 | |
| 5GHz | － | 0.011 | 0.008 | 0.007 | 0.011 | ||
| 10GHz | － | 0.012 | 0.008 | 0.008 | 0.012 | ||
| Insulation R乐竞全站官网在线登录istance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Surface R乐竞全站官网在线登录istance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Volume R乐竞全站官网在线登录istivity | C-96/20/65 | Ω･cm | 1015-16 | 1016-17 | 1016-17 | 1016-17 | |
| Flexural Strength | MPa | 450 | 490 | 750 | 550 | ||
| Flexural Modulus | GPa | 28 | 27 | 30 | 30 | ||
| Tensile Strength | MPa | 270 | 290 | 400 | 280 | ||
| Young's Modulus | GPa | 28 | 27 | 30 | 30 | ||
| Glass Transition Temp. | DMA | ºC | 230 | 255 | 255 | 230 | |
| TMA | ºC | 200 | 230 | 230 | 210 | ||
| Cofficent of Thermal Expansion | X,Y | α1 | ppm/ºC | 14 | 10 | 7 | 8 |
| X,Y | α2 | ppm/ºC | 5 | 3 | 3 | 3 | |
| Peel Strength | 12μm | KN/m | 0.85 | 1.0 | 1.0 | 1.0 | |
| Flame R乐竞全站官网在线登录istance | E-168/70 | － | V-0 | V-0 | V-0 | V-0 | |
| Density | g/cm3 | 2.1 | 1.9 | 1.9 | 2.0 | ||
| Specific heat | J/g・K | 1.00 | 1.00 | 0.95 | 0.95 | ||
| Thermal Conductivity | W/m*K | 0.8 | 0.6 | 0.6 | 0.7 | ||
| Poissin's ratio | － | 0.19 | 0.18 | 0.18 | 0.18 | ||
| Moisture absorption | 85 ºC/85RH% 168h | % | 0.44 | 0.31 | 0.30 | 0.32 | |
| Item | Measurement Method |
Unit | HL832NSR type LCA |
HL832NSF | HL832NSF typeLCA |
HL832 NSA typeLCA |
|
|---|---|---|---|---|---|---|---|
| Dielectric Constant | 1GHz | － | 4.1 | 4.4 | 4.0 | 4.0 | |
| 5GHz | － | 4.0 | 4.4 | 4.0 | 4.0 | ||
| 10GHz | － | 4.0 | 4.3 | 3.9 | 3.9 | ||
| Dissipation Factor | 1GHz | － | 0.008 | 0.006 | 0.006 | 0.005 | |
| 5GHz | － | 0.011 | 0.008 | 0.008 | 0.007 | ||
| 10GHz | － | 0.012 | 0.008 | 0.008 | 0.007 | ||
| Insulation R乐竞全站官网在线登录istance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Surface R乐竞全站官网在线登录istance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Volume R乐竞全站官网在线登录istivity | C-96/20/65 | Ω･cm | 1016-17 | 1016-17 | 1016-17 | 1016-17 | |
| Flexural Strength | MPa | 670 | 510 | 600 | 420 | ||
| Flexural Modulus | GPa | 33 | 32 | 34 | 31 | ||
| Tensile Strength | MPa | 420 | 290 | 390 | 350 | ||
| Young's Modulus | GPa | 33 | 32 | 34 | 31 | ||
| Glass Transition Temp. | DMA | ºC | 230 | 300 | 300 | 350 | |
| TMA | ºC | 210 | 270 | 270 | 270 | ||
| Cofficent of Thermal Expansion | X,Y | α1 | ppm/ºC | 4.5 | 5 | 3 | 1 |
| X,Y | α2 | ppm/ºC | 2 | 3 | 2 | 0.5 | |
| Peel Strength | 12μm | KN/m | 1.0 | 0.8 | 0.8 | 0.6 | |
| Flame R乐竞全站官网在线登录istance | E-168/70 | － | V-0 | V-0 | V-0 | V-0 | |
| Density | g/cm3 | 2.0 | 2.0 | 2.0 | 2.0 | ||
| Specific heat | J/g･K | 0.95 | 0.9 | 0.9 | 0.9 | ||
| Thermal Conductivity | W/m*K | 0.7 | 0.7 | 0.7 | 0.7 | ||
| Poissin's ratio | － | 0.18 | 0.19 | 0.18 | 0.15 | ||
| Moisture absorption | 85 ºC/85RH% 168h | % | 0.32 | 0.35 | 0.35 | 0.39 | |
| Item | Measurement Method |
Unit | HL972LF typeLD | HL972LFG | HL972LFG typeLD | GHPL-830SR | GHPL-830SR typeLC | |
|---|---|---|---|---|---|---|---|---|
| Dielectric Constant | 1GHz | － | 3.5 | 4.0 | 3.5 | 3.9 | 3.7 | |
| 5GHz | － | 3.5 | 3.9 | 3.5 | 3.8 | 3.6 | ||
| 10GHz | － | 3.4 | 3.8 | 3.4 | 3.7 | 3.5 | ||
| Dissipation Factor | 1GHz | － | 0.003 | 0.003 | 0.002 | 0.009 | 0.009 | |
| 5GHz | － | 0.004 | 0.004 | 0.002 | 0.01 | 0.01 | ||
| 10GHz | － | 0.004 | 0.004 | 0.002 | 0.011 | 0.011 | ||
| Insulation R乐竞全站官网在线登录istance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Surface R乐竞全站官网在线登录istance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Volume R乐竞全站官网在线登录istivity | C-96/20/65 | Ω･cm | 1016-17 | 1016-17 | 1016-17 | 1016-17 | 1016-17 | |
| Flexural Strength | MPa | 370 | 450 | 440 | 420 | 490 | ||
| Flexural Modulus | GPa | 25 | 23 | 21 | 21 | 22 | ||
| Tensile Strength | MPa | 220 | 210 | 210 | 290 | 300 | ||
| Young's Modulus | GPa | 25 | 23 | 21 | 21 | 22 | ||
| Glass Transition Temp. | DMA | ºC | 270 | 215 | 215 | 195 | 195 | |
| TMA | ºC | 240 | 200 | 200 | 160 | 160 | ||
| Cofficent of Thermal Expansion | X,Y | α1 | ppm/ºC | 10 | 11 | 10 | 8.3 | 6.3 |
| X,Y | α2 | ppm/ºC | 4 | 4 | 4 | 3 | 2 | |
| Peel Strength | 12μm | KN/m | 0.7 | 0.7 | 0.7 | 1.0 | 1.0 | |
| Flame R乐竞全站官网在线登录istance | E-168/70 | － | V-0 | V-0 rating |
V-0 rating |
V-0 rating |
V-0 rating |
|
| Density | g/cm3 | 1.9 | 1.8 | 1.8 | 1.8 | 1.8 | ||
| Specific heat | J/g･K | 0.9 | 0.95 | 0.95 | 0.9 | 0.9 | ||
| Thermal Conductivity | W/m*K | 0.6 | 0.6 | 0.6 | 0.7 | 0.7 | ||
| Poissin's ratio | － | 0.2 | - | - | 0.21 | 0.21 | ||
| Moisture absorption | 85 ºC/85RH% 168h | % | 0.35 | 0.27 | 0.27 | 0.25 | 0.25 | |
※MGC also has halogen free materials, CCL-HL820 and CCL-HL820WDI.
*1: Please refer to URL on the right, regarding UL certification of flame r乐竞全站官网在线登录istance.[UL Certification]
*2: Typical properti乐竞全站官网在线登录 of 45um prepreg.
Inquiri乐竞全站官网在线登录 Concerning Products
Specialty Chemicals Busin乐竞全站官网在线登录s Sector
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